The Prospect Of Flexible Circuit Boards

Aug. 23, 2019

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Flexible Board

The flexible circuit industry is in the midst of a small but rapid development. The polymer thick film process is an efficient, low-cost production process. The process selectively screens conductive polymer inks on inexpensive flexible substrates. A representative flexible substrate is PET. Polymer thick film conductors include silk screen metal fillers or carbon powder fillers. The polymer thick film process itself is very clean, using lead-free SMT adhesives, without etching. Due to the use of the addition process and low substrate cost, the polymer thick film method is 1/10 of the price of the copper polyimide film circuit; it is 1/2 to 1/3 of the price of the rigid board. The polymer thick film method is especially suitable for control panels of equipment. In mobile phones and other portable products, the polymer thick film method is suitable for converting components, switches and lighting devices on printed circuit boards into polymer thick film circuits. It saves costs and reduces energy consumption.

In the next few years, smaller, more complex, and more expensively constructed flexible circuits will require newer method assemblies and the need to add hybrid flexible circuits. The challenge for the flexible circuit industry is to leverage its technological advantages to keep pace with computers, telecommunications, consumer demand and an active market. In addition, flexible circuits will play an important role in lead-free operations.

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